trends in semiconductor design, challenges of semiconductor design, semiconductor design software, 3D IC design, semiconductor manufacturing, etc.
security, privacy, and trust management, RFID chips application, the advanced techniques involved, RFID sensors, RFID components, etc.
Incompatible Complementary Metal Oxide Semiconductor (CMOS) stack-up, co-design of circuits and on-chip antenna, on-Chip Antenna layout issue, on-chip antenna characterization, Antenna on Chip (AoC) design, etc.
the comparison of different commonly used technologies involving flip-chip design and process, the effect of bare die or die-size components in an uncased or minimally cased format, the impact on current component characteristics, reviews of the appropriate PCB design guidelines to ensure efficient assembly processing, etc.