New Chip Materials
Submission deadline: 2023-12-31
Section Collection Editors

Section Collection Information

Dear Colleagues,


Advances in chip materials are driving innovation in the field of integrated circuits and device manufacturing. This section encompasses a broad range of topics, from the physical and chemical properties of materials to the latest manufacturing and characterization technologies. Recent research has focused on developing advanced chip materials with optimized performance characteristics, such as high electron mobility and low power consumption. These breakthroughs in chip materials have enabled faster computation and higher device densities, while also reducing the costs associated with chip manufacturing. Some examples of new chip materials include 2D materials, such as graphene, transition metal dichalcogenides, and hafnium oxide, which offer unique properties for use in device manufacturing. In addition, advances in manufacturing technologies, such as extreme ultraviolet lithography (EUV), have enabled the creation of increasingly complex devices with smaller feature sizes. This section aims to foster discussion and collaboration among researchers and practitioners in the field of new chip materials, sharing knowledge and discoveries to drive continued progress and innovation.

 

We welcome research articles and reviews on new chip materials, including physical and chemical properties, advanced manufacturing, and characterization. Share your knowledge and discoveries to drive continued progress and innovation in the field.


Dr. Kui Ma

Section Editor

Keywords

chip materials physics; electronic materials, metals and insulation materials; wide band-gap and ultra-wide band-gap semiconductor materials; interface characteristics; advanced materials and nanotechnology; manufacturing process of chip materials; testing and characterization methods for materials; materials for advanced integration technology

Published Paper